■ Applicable to the soldering of such products as Camera Modules, BGA re-balling, wafers, optoelectronic products, sensors, TWS speakers, …etc.
■ No flux soldering and minimized pollution process
■ Melted ball in the tip with no splash occurred
■ The amount of soldering is controllable and stable, meeting the requirements of the products with high speed, high frequency and high precision requirements
■ Consistent soldering quality and high first pass yield
■ Configured CCD visual position...