■ Removal the organic contaminants, improving material adhesion and promoting fluid flow
■ Application scenarios: surface preparation through surface activation and contamination removal before glue dispensing & coating process
■ Application products: electronic device assembly, printed circuit board (PCB) manufacturing and medical device manufacturing.
■ Spraying nozzle size: φ2mm~φ70mm available
■ Processing height: 5~15mm
■ PLASMA generator power: 200W~800W available
■ Working gas: N2, argon, Oxygen, Hydrogen, or a mixture of these gases
■ Gas consumption: 50L/min
■ PC control with option to connect factory MES system
■ CE marked
■ Free sample testing program available
■ Plasma cleaning principle
■ Why choose Plasma Cleaning
■ Cleans even in the smallest cracks and gaps
■ Clean and safe source
■ Cleans all component surfaces in one step, even the interior of hollow components
■ No damage to solvent-sensitive surfaces by chemical cleaning agents
■ Removal of molecularly fine residues
■ No thermal stress
■ Fit for immediate further processing (which is highly desired)
■ No storage and disposal of hazardous, polluting and harmful cleaning agents
■ High quality and High-speed cleaning
■ Very low running cost