Manufacturer for Laser Bonding - JKTECH Laser Ball Jetting Machine – JKTech

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Manufacturer for Laser Bonding - JKTECH Laser Ball Jetting Machine – JKTech Detail:

Laser Solder Ball Jetting Machine3
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■ Applicable to the soldering of such products as Camera Modules, BGA re-balling, wafers, optoelectronic products, sensors, TWS speakers, …etc.

■ No flux soldering and minimized pollution process

■ Melted ball in the tip with no splash occurred

■ The amount of soldering is controllable and stable, meeting the requirements of the products with high speed, high frequency and high precision requirements

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■ Consistent soldering quality and high first pass yield

■ Configured CCD visual position system

■ Able to Connect to a upper PCBA loader and unloader, to realize fully automatic production and save manpower

■ Fast heating and super-fast ball jetting speed up to 15k balls/h (PPH)

■ Varied diameter of solder ball available between φ0.30 to 2.0mm

■ Applied to the metal surface of tin, gold and silver with a yield rate>99%

■ CE marked

■ Free sample testing program available

Standard Model	JK-LBS200
Laser power	75W
Wavelength	1064 nm
Fiber diameter	200um-600um (optional)
Life span of laser source	＞80,000Hrs.
Working area	200x150mm (optional)
Solder ball diameter	φ0.30 to 2.0mm
Alignment system	CCD
Operation system	WIN10
Exhaust system	Build-in smoke purifier
N2 supply	＞ 0.5MPa @99.999%
Power supply	220V 50Hz, 10A
Footprint	Approx. 1000x1100x1650mm

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Automatic Laser Ball Jetting